Key steps in California Proposition 65 testing process for circuit boards
Date：2025-11-13 09:43:47 Classification
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California Proposition 65 requires the California government to update its hazardous substance list at least annually. Currently, nearly a thousand chemicals are listed. The key steps in the complete process for Proposition 65 testing of circuit boards are as follows:
I. Preliminary Preparation: Substance Screening and Exposure Assessment
1. Identifying High-Risk Substances
| Substance Category | Specific Risk Points on Circuit Boards | California Proposition 65 Limits
| Lead (Pb) | Solder, Lead Plating | ≥0.1% requires a warning (except for exemptions)
| Cadmium (Cd) | Electrode Materials, Stabilizers | ≥0.03% requires a warning
| Phthalate Esters | Plastic Connectors, Housings | ≥0.1% requires a warning
| Nickel Compounds | Electroplating, Battery Contacts | Soluble Nickel ≥0.5μg/cm²/week
| Polybrominated Diphenyl Ethers (PBDEs) | Flame Retardants | ≥0.1% requires a warning
Note: Added in 2025 Cobalt compounds (lithium battery electrolytes) need to be screened (soluble cobalt ≥ 0.06 μg/cm²/week).
2. Exposure Scenario Analysis
- General User Contact: Finger touch of circuit board (migration wiping test)
- Maintenance Personnel Contact: Inhalation of soldering fumes (volatile matter detection)
- Child Accidental Contact Risk: Circuit board embedded in toy (saliva-simulated migration)
II. Laboratory Testing: Methods and Sample Requirements
1. Sample Specifications
| Sample Type | Quantity | Processing Requirements
| Bare Circuit Board | 5 pieces | Including solder joints from different batches
| Complete Unit with Housing | 3 units | Powered on and running
| Individual Plastic Parts | 200g | Taken from connector/housing
2. Core Testing Methods
A [Chemical Screening] --> A1 (ICP-MS detection of heavy metals)
A --> A2 (GC-MS detection of plasticizers)
B [Migration Test] --> B1 (Skin Contact Simulation: EN 1811)
B --> B2 (Salivary Migration: CPSC-CH-E1001-08.3)
C [Volatile Matter Detection] --> C1 (Thermal Desorption - GC/MS Measurement of Solder Fumes)
3. Exemption Circumstances Verification
- Lead-containing solder exemption: Complies with RoHS exemption provisions (e.g., high-temperature solder SnPb≥85%)
- Nickel sealing coating: Provide a coating sealing report (porosity ≤0.01%)
III. Compliance Judgment and Label Management
1. Risk Assessment Formula
Calculate the "No Significant Risk Level (NSRL)" and "Maximum Allowable Dose Level (MADL)":
$$ \text{Exposure} = \frac{\text{Substance Concentration} \times \text{Exposure Frequency} \times \text{Absorption Rate}}{\text{Body Weight}} $$
- If exposure > NSRL/MADL → Mandatory warning labeling
2. Warning Label Specifications
- Content Template (Yellow Background, Black Text):
⚠️ WARNING: This product contains lead, a chemical known to the State of California to cause birth defects or other reproductive harm.
- Affixing Locations:
- Product Outer Packaging
- Instruction Manual First Page
- E-commerce Page Details (Mandatory by 2025)
3. Supply Chain Document Integration
- Supplier Material Declaration (SDS + Test Report)
- Exemption Documents (e.g., RoHS Exemption Certificate for Solder)
IV. Common Failure Cases and Countermeasures
| Risk Points | Solutions
| Solder Lead Not Labeled | Apply for Exemption or Switch to Lead-Free Solder (SnAgCu)
| Excessive Nickel Migration | Gold Plating Thickened to ≥0.2μm
| Missing Label on E-commerce Page | Embed Warning Icon in Amazon/Walmart Description Bar
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